To top
RA150 hot air station for non contact SMD reworks
  • High heating element power and stabile air flow¬†- work with¬†chip, SO, QFP, PLCC components and also few BGA structures¬†
  • Non-contact¬†hot air components assembling and disassemblying¬†
  • Precise, microprocessor stabilized temperature and air flow
  • Large and readable display
  • Extended heating element life time¬†- microprocessor protection¬†
  • Wide range of acid-proof steel nozzles¬†
  • One nozzle and mounting adapter as standard¬†
  • Fast nozzle replacement
Application
  • Assembly and disassembly of wide range SMT as well as PTH¬†
  • Service works -¬†disassembly and electronic components replacement¬†
  • Production -¬†as a base of assembly station
Advantages
  • Heating element power¬†and stabile air flow - suitable for work with¬†CHIP, SO, QFP, PLCC, BGA¬†
  • Non-contact¬†assembly and disassembly of components with hot air
  • Microprocessor controlled, precise temperature and air flow stabilization
  • Large and readable display
  • Extended heating element life time - microprocessor protection¬†
  • Wide range of nozzles made of acid-proof steel
  • One nozzle and mounting adapter as standard¬†
  • Fast nozzles replacement
  • Unique heating element cool down feature right after power switch off¬†
  • Adding assembly/disassembly hot air station¬†with pre heater and stand we get advanced work station¬†and possibility to perform works¬†impossible so far¬†to do
Technical data
  • Input power: 230 V AC, 50-60 Hz¬†
  • Power consumption: 600 W max.¬†
  • Air flow control range: 2-20 l/min, +/- 10%¬†
  • Temperature control range: 150oC - 475oC
  • Adjustment/display regulation: 1oC ; 1 l/min
  • Temperature stability: +/- 2oC
  • Ext. dimensions: 240 x 190 x 125 mm¬†
  • Weight: 3 kg
Standard equipment
Optional equipment
  • RA-150¬†station
  • REECO¬†nozzles adapter
  • RE-PN5¬†nozzle
  • Grip¬†for handle